PCB Material Specification: Aluminum Clad
| Physical Properties | Values | Units |
| Resin / Base | Epoxy Glass | - |
| Color | Green | - |
| Fungus Resistance | - | - |
| Solvent Resistant | - | - |
| Specific Gravity | - | - |
| Transparency | - | - |
| Water Absorption | 0.10 | % |
| Mechanical Properties | Values | Units |
| Compressive Strength | - | PSI x 10^3 |
| Flexural Strength - Length | 7.20 | PSI x 10^3 |
| Flexural Strength - Cross | 5.02 | PSI x 10^3 |
| Flexural Modulus - Length | 1.02 | PSI x 10^6 |
| Flexural Modulus - Cross | 1.03 | PSI x 10^6 |
| Izod Impact - Length | - | Ft. lbs/In. notch |
| Laminate Bond Strength | - | Lbs |
| Punching Temperature | - | °F |
| Rockwell Hardness | - | M Scale |
| Electrical Properties | Values | Units |
| Capacitance Drift | - | - |
| Dielectric Constant 1 MHz | 3.67 | D24/23 |
| Dissipation Factor 1 MHz | .022 | D24/23 |
| Dielectric Breakdown (Para) | - | KV |
| Dielectric Strength (Perp) | 800 | V/MIL |
| Resistivity Surface | 11 | Megohms x 10^4 |
| Insulation Resistance (EIA Pattern) | - | Megohms x 10^6 |
| Thermal Properties | Values | Units |
| Glass Transition | 105 | °C |
| Thermal Conductivity | 4 | (5) |
| Coefficient of Expansion - Length | - | In./In./C x 10^-5 |
| Coefficient of Expansion - Cross | - | In./In./C x 10^-5 |
| Underwriter Lab Rating | Values | Units |
| Flammability | 94V-0 | - |
| High Ampere Arc | - | Cycles |
| High Voltage Tracking | - | In./Min |
| Soldering Limits - 500F | - | Seconds |
| Soldering Limits - 525F | - | Seconds |
| Maximum Operating Temperature | 130 | °C |
